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INVENTORS: Akram; Salman (Boise, ID)
ASSIGNEES: Micron Technology, Inc. (Boise, ID)
U.S. CLASS: 257/781; 257/642; 257/683
ABSTRACT: A method for forming packaged substrates, including flip-chip dice individually or in a multi-die wafer. The method includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of the substrate. In addition, the invention encompasses forming a similar layer on a second substrate to be joined to the first substrate. Contact pads of the second substrate are exposed through the layer thereon to facilitate joining of the two substrates. Semiconductor devices formed by the method are also disclosed. XX
